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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
02/21/2012
Application #:
11903190
Filing Dt:
09/20/2007
Publication #:
Pub Dt:
03/27/2008
Inventors:
Chris Apanius, Hendra Ng, Robert A. Shick, Andrew Bell, Wei Zhang, Phil Neal
Title:
METHODS AND MATERIALS USEFUL FOR CHIP STACKING, CHIP AND WAFER BONDING
Assignment: 1
Reel/Frame:
020394/0922Recorded: 01/22/2008Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/09/2008
Exec Dt:
01/04/2008
Exec Dt:
01/03/2008
Exec Dt:
01/03/2008
Exec Dt:
01/03/2008
Exec Dt:
01/02/2008
Assignee:
9921 BRECKSVILLE ROAD, BUILDING R
BRECKSVILLE, OHIO 44141
Correspondent:
THE WEBB LAW FIRM PC
436 SEVENTH AVENUE, 700 KOPPERS BUILDING
PITTSBURGH, PA 15219
Assignment: 2
Reel/Frame:
029409/0440Recorded: 12/05/2012Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/05/2012
Assignee:
5-8 HIGASHI-SHINAGAWA, 2-CHOME SHINAGAWA-KU
TOKYO, JAPAN 140-0002
Correspondent:
PROMERUS LLC
9921 BRECKSVILLE ROAD
BRECKSVILLE, OH 44141

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