Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/28/2012
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Application #:
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12927172
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Filing Dt:
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11/08/2010
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Publication #:
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Pub Dt:
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06/16/2011
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Inventors:
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Ming Sun, Yueh Se Ho
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Title:
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VERTICALLY PACKAGED MOSFET AND IC POWER DEVICES AS INTEGRATED MODULE USING 3D INTERCONNECTED LAMINATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| CANNON'S COURT 22, VICTORIA STREET |
| HAMILTON, BERMUDA HM12 |
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| BO-IN LIN |
| 13445 MANDOLI DRIVE |
| LOS ALTOS HILLS, CA 94022 |
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