Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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02/28/2012
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Application #:
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11778558
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Filing Dt:
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07/16/2007
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Publication #:
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Pub Dt:
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01/22/2009
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Inventors:
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Yu-Hsiung Wang, Wen-Ting Chu, Eric Chen, Hsien-Wei Chin
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Title:
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METHOD FOR RESHAPING SILICON SURFACES WITH SHALLOW TRENCH ISOLATION
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| SLATER & MATSIL, L.L.P. |
| 17950 PRESTON ROAD |
| SUITE 1000 |
| DALLAS, TX 75252 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE MICROSOFT WAY |
| REDMOND, WASHINGTON 98052 |
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| MICROSOFT TECHNOLOGY LICENSING, LLC |
| ONE MICROSOFT WAY |
| REDMOND, WA 98052 |
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