Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/06/2012
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Application #:
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12928067
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Filing Dt:
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12/02/2010
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Inventors:
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Saravuth Sirinorakul, Somchai Nondhasitthichai
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Title:
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METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE CONTAINING FLIP-CHIP ARRANGEMENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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22 ANG MO KIO INDUSTRIAL PARK 2 |
SINGAPORE, SINGAPORE 569506 |
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HORIZON IP PTE. LTD. |
7500A BEACH ROAD, #04-306/308 |
THE PLAZA |
SINGAPORE, 199591 SINGAPORE |
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05/31/2024 12:49 AM
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