Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/06/2012
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Application #:
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12113393
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Filing Dt:
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05/01/2008
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Publication #:
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Pub Dt:
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12/25/2008
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Inventor:
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Kei MURAYAMA
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Title:
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ELECTRONIC COMPONENT PACKAGE AND METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC COMPONENT DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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80, OSHIMADA-MACHI, |
NAGANO-SHI, NAGANO, JAPAN 381-2287 |
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KRATZ, QUINTOS & HANSON, LLP |
1420 K STREET, N.W., SUITE 400 |
WASHINGTON, DC 20005 |
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