Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/20/2012
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Application #:
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12057241
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Filing Dt:
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03/27/2008
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Publication #:
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Pub Dt:
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10/01/2009
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Inventors:
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Xunqing Shi, Wei Ma, Chang Hwa Chung, Bin Xie
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Title:
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PULSE-LASER BONDING METHOD FOR THROUGH-SILICON-VIA BASED STACKING OF ELECTRONIC COMPONENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3RD FLOOR, BIO-INFORMATICS CENTRE |
| 2 SCIENCE PARK WEST AVENUE, HONG KONG SCIENCE PARK |
| SHATIN, NEW TERRITORIES, HONG KONG |
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| WELLS ST JOHN PS |
| 601 W. FIRST AVE, SUITE 1300 |
| SPOKANE, WA 99201-3828 |
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