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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8143155
Issue Dt:
03/27/2012
Application #:
12589481
Filing Dt:
10/21/2009
Publication #:
20100207280
Pub Dt:
08/19/2010
Inventors:
Tatsunari Mii, Shinsuke Tei, Hayato Kiuchi
Title:
WIRE BONDING METHOD AND SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
024018/0736Recorded: 03/01/2010Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
MII, TATSUNARI
Exec Dt:
02/08/2010
TEI, SHINSUKE
Exec Dt:
02/10/2010
KIUCHI, HAYATO
Exec Dt:
02/12/2010
Assignee:
KABUSHIKI KAISHA SHINKAWA
2-51-1, INADAIRA, MUSASHIMURAYAMA-SHI
TOKYO, JAPAN
Correspondent:
WILLIAM L. ANDROLIA
QUINN EMANUEL URGUHART OLIVER & HEDGES,
LLP KODA/ANDROLIA
865 SOUTH FIGUEROA STREET, 10TH FLOOR
LOS ANGELES, CALIFORNIA 90017
Assignment: 2
Reel/Frame:
027372/0925Recorded: 12/13/2011Pages: 5
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE 2ND AND 3RD INVENTORS DOC DATE PREVIOUSLY RECORDED ON REEL 024018 FRAME 0736. ASSIGNOR(S) HEREBY CONFIRMS THE (SEE DOCUMENT FOR DETAILS).
Assignors:
MII, TATSUNARI
Exec Dt:
02/08/2010
TEI, SHINSUKE
Exec Dt:
02/12/2010
KIUCHI, HAYATO
Exec Dt:
02/10/2010
Assignee:
KABUSHIKI KAISHA SHINKAWA
2-51-1, INADAIRA, MUSASHIMURAYAMA-SHI
TOKYO, JAPAN 208-8585
Correspondent:
KATTEN MUCHIN ROSENMAN LLP
575 MADISON AVENUE
15TH FLOOR, IP DEPT.
NEW YORK, NY 10022-2585

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