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Patent Assignment Abstract of Title
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Total Assignments: 4
Patent #:
8143722
Issue Dt:
03/27/2012
Application #:
11867646
Filing Dt:
10/04/2007
Publication #:
20080083986
Pub Dt:
04/10/2008
Inventors:
Anthony Curtis, Guy F. Burgess, Yuan Lu, Michael Johnson, Ted Tessier
Title:
WAFER-LEVEL INTERCONNECT FOR HIGH MECHANICAL RELIABILITY APPLICATIONS
Assignment: 1
Reel/Frame:
019939/0740Recorded: 10/10/2007Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CURTIS, ANTHONY
Exec Dt:
02/14/2007
BURGESS, GUY F.
Exec Dt:
02/14/2007
JOHNSON, MICHAEL
Exec Dt:
02/14/2007
TESSIER, TED
Exec Dt:
02/15/2007
LU, YUAN
Exec Dt:
03/05/2007
Assignee:
FLIPCHIP INTERNATIONAL, LLC
3701 E. UNIVERSITY DRIVE
PHOENIX, ARIZONA 85034
Correspondent:
CHARLES BERMAN
2450 COLORADO AVENUE, STE. 400E
GREENBERG TRAURIG LLP
SANTA MONICA, CA 90404
Assignment: 2
Reel/Frame:
027212/0515Recorded: 11/10/2011Pages: 32
Conveyance:
SECURITY AGREEMENT
Assignor:
FLIPCHIP INTERNATIONAL, LLC
Exec Dt:
10/24/2011
Assignee:
WELLS FARGO BANK, NATIONAL ASSOCIATION
100 WEST WASHINGTON STREET, 15TH FLOOR
WELLS FARGO PLAZA, MAC S4101-158
PHOENIX, ARIZONA 85003
Correspondent:
BRYAN CAVE LLP
TWO NORTH CENTRAL AVENUE, SUITE 2200
ALLAN W. WATTS
PHOENIX, AZ 85004
Assignment: 3
Reel/Frame:
055292/0898Recorded: 02/17/2021Pages: 7
Conveyance:
RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS).
Assignor:
WELLS FARGO BANK, NATIONAL ASSOCIATION
Exec Dt:
02/15/2021
Assignee:
FLIPCHIP INTERNATIONAL, LLC
3701 E. UNIVERSITY DRIVE
PHOENIX, ARIZONA 85034
Correspondent:
GREENBERG TRAURIG, LLP
2200 ROSS AVENUE
SUITE 5200
DALLAS, TX 75201
Assignment: 4
Reel/Frame:
056612/0882Recorded: 06/17/2021Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
FLIPCHIP INTERNATIONAL, LLC
Exec Dt:
05/17/2021
Assignee:
HUATIAN TECHNOLOGY(KUNSHAN) ELECTRONICS CO.,LTD.
112 LONGTENG ROAD, ECONOMIC & TECHNICAL DEVELOPMENT ZONE
KUNSHAN, JIANGSU, CHINA 215300
Correspondent:
GANG YU
ACIP INTERNATIONAL, INC. 419 10TH ST,
SF, CA 94103

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