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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
04/10/2012
Application #:
12398520
Filing Dt:
03/05/2009
Publication #:
Pub Dt:
10/01/2009
Inventors:
Shuji Yoneda, Masato Oishi, Tamotsu Shinohara, Shinji Watanabe, Koji Miyata, Seiji Fukae et al
Title:
SEMICONDUCTOR DEVICE WITH GROOVE STRUCTURE TO PREVENT MOLDING RESIN OVERFLOW OVER A LIGHT RECEIVING REGION OF A PHOTODIODE DURING MANUFACTURE AND METHOD FOR MANUFACTURING SAME
Assignment: 1
Reel/Frame:
022350/0852Recorded: 03/05/2009Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
01/28/2009
Exec Dt:
02/10/2009
Exec Dt:
02/02/2009
Exec Dt:
02/03/2009
Exec Dt:
02/03/2009
Exec Dt:
02/03/2009
Exec Dt:
02/02/2009
Exec Dt:
02/10/2009
Exec Dt:
02/05/2009
Assignee:
1-7-1 KONAN, MINATO-KU
TOKYO 108-0075, JAPAN
Correspondent:
SONNENSCHEIN NATH & ROSENTHAL LLP
P.O. BOX 061080
WACKER DRIVE STATION, SEARS TOWER
CHICAGO, IL 60606-1080
Assignment: 2
Reel/Frame:
040419/0001Recorded: 10/19/2016Pages: 42
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/06/2016
Assignee:
4-14-1 ASAHI-CHO, ATSUGI-SHI
KANAGAWA, JAPAN
Correspondent:
ROXANA A. SULLIVAN
181 W MADISON STREET, SUITE 4500
CHICAGO, IL 60602

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