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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8181688
Issue Dt:
05/22/2012
Application #:
12760640
Filing Dt:
04/15/2010
Publication #:
20110014774
Pub Dt:
01/20/2011
Inventors:
HALE JOHNSON, PATRICK GORUN, EMMETT HUGHLETT, JAMES HERMANOWSKI, MICHAEL KUHNLE et al
Title:
APPARATUS FOR TEMPORARY WAFER BONDING AND DEBONDING
Assignment: 1
Reel/Frame:
025091/0005Recorded: 10/05/2010Pages: 9
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
JOHNSON, HALE
Exec Dt:
04/26/2010
GORUN, PATRICK
Exec Dt:
04/26/2010
HUGHLETT, EMMETT
Exec Dt:
10/04/2010
HERMANOWSKI, JAMES
Exec Dt:
04/30/2010
STILES, MATTHEW
Exec Dt:
04/26/2010
KUHNLE, MICHAEL
Exec Dt:
04/26/2010
Assignee:
SUSS MICROTEC INC
228 SUSS DRIVE
WATERBURY CENTER, VERMONT 05677
Correspondent:
AKC PATENTS
215 GROVE STREET
NEWTON, MA 02466
Assignment: 2
Reel/Frame:
025952/0868Recorded: 03/15/2011Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
SUSS MICROTEC INC
Exec Dt:
03/10/2011
Assignee:
SUSS MICROTEC LITHOGRAPHY, GMBH
90 SCHLEISSHEIMER STR
GARCHING, GERMANY 85748
Correspondent:
AKC PATENTS
215 GROVE STREET
NEWTON, MA 02466

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