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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
05/29/2012
Application #:
11756621
Filing Dt:
05/31/2007
Publication #:
Pub Dt:
02/26/2009
Inventors:
Michael Chen, Mark Chou, Mou-Shiung Lin, Chien-Kang Chou
Title:
WIREBOND PAD FOR SEMICONDUCTOR CHIP OR WAFER
Assignment: 1
Reel/Frame:
020113/0983Recorded: 11/15/2007Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/01/2004
Exec Dt:
02/01/2004
Exec Dt:
02/01/2004
Exec Dt:
02/01/2004
Assignee:
ROOM 301/302, NO. 47, PARK 2ND RD.,
HSINCHU, TAIWAN 300
Correspondent:
MEGICA CORPORATION
ROOM 301/302, NO. 47, PARK 2ND RD.,
HSINCHU, 300 TAIWAN
Assignment: 2
Reel/Frame:
031283/0198Recorded: 09/25/2013Pages: 18
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/11/2013
Assignee:
5775 MOREHOUSE DRIVE
SAN DIEGO, CALIFORNIA 92121
Correspondent:
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE
SAN DIEGO, CA 92121-1714
Assignment: 3
Reel/Frame:
033303/0124Recorded: 07/11/2014Pages: 80
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/09/2014
Assignee:
5775 MOREHOUSE DRIVE
SAN DIEGO, CALIFORNIA 92121
Correspondent:
QUALCOMM INCORPORATED
5775 MOREHOUSE DRIVE
SAN DIEGO, CA 92121

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