Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/03/2012
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Application #:
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12078269
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Filing Dt:
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03/28/2008
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Publication #:
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Pub Dt:
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10/02/2008
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Inventors:
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Takanori Yamashita, Masataka Okushita, Hirohisa Akita, Hiroshi Hoya
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Title:
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PACKAGING MATERIAL FOR FLAT ELECTROCHEMICAL CELL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, ICHIGAYA KAGACHO 1-CHOME |
| SHINJUKU-KU, TOKYO 162-8001, JAPAN |
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| 5-2, HIGASHI-SHIMBASHI 1-CHOME |
| MINATO-KU, TOKYO 105-7117, JAPAN |
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| KENDREW H. COLTON |
| FITCH, EVEN, TABIN & FLANNERY |
| ONE LAFAYETTE CENTRE |
| 1120 - 20TH STREET, NW, SUITE 750 SOUTH |
| WASHINGTON, DC 20036 |
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