Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
Total Assignments:
1
|
Patent #:
|
|
Issue Dt:
|
07/03/2012
|
Application #:
|
12649092
|
Filing Dt:
|
12/29/2009
|
Publication #:
|
|
Pub Dt:
|
06/30/2011
| | | | |
Inventors:
|
Hung-Hsin Hsu, Chin-Ming Hsu, Jui-Ching Hsu
|
Title:
|
SEMICONDUCTOR PACKAGE HAVING CHIP USING COPPER PROCESS
|
|
Assignment:
1
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
NO. 26, DATONG RD., HSINCHU INDUSTRIAL PARK |
HUKOU SHIANG, HSINCHU, TAIWAN |
|
|
|
MUNCY, GEISSLER, OLDS, & LOWE PLLC |
PO BOX 1364 |
FAIRFAX, VA 22038 |
|
|
Search Results as of:
05/09/2024 09:12 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|