Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/03/2012
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Application #:
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12444230
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Filing Dt:
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03/12/2010
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Publication #:
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Pub Dt:
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06/24/2010
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Inventors:
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Syuichi Mori, Yuji Hasegawa, Minoru Sugiura
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Title:
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RESIN PASTE FOR DIE BONDING, CONTAINING A POLYURETHANEIMIDE RESIN AND THERMOSETTING RESIN METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE, USING THE RESIN PASTE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, NISHI-SHINJUKU 2-CHOME |
| SHINJUKU-KU |
| TOKYO, JAPAN 163-0449 |
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| ANTONELLI, TERRY, STOUT & KRAUS, LLP |
| 1300 NORTH SEVENTEENTH STREET |
| SUITE 1800 |
| ARLINGTON, VA 22209-3873 |
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