Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/10/2012
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Application #:
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12106368
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Filing Dt:
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04/21/2008
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Publication #:
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Pub Dt:
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10/22/2009
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Inventors:
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Xiangsheng PAN, Gary Peter WIDDOWSON
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Title:
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COLLET MOUNTING ASSEMBLY FOR A DIE BONDER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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20/F., WATSON CENTRE |
16-22 KUNG YIP ST. |
KWAI CHUNG, HONG KONG |
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OSTROLENK FABER GERB & SOFFEN |
1180 AVENUE OF THE AMERICAS |
NEW YORK, NY 100368403 |
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Assignment:
2
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CORRECTIVE ASSIGNMENT TO CORRECT THE CONVEYING PARTY NAME, PREVIOUSLY RECORDED AT REEL 020830 FRAME 0204.
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20/F., WATSON CENTRE |
16-22 KUNG YIP ST. |
KWAI CHUNG, HONG KONG |
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OSTROLENK, FABER, GERB & SOFFEN, LLP |
1180 AVENUE OF THE AMERICAS |
NEW YORK, NEW YORK 10036-8403 |
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