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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
07/10/2012
Application #:
11152984
Filing Dt:
06/14/2005
Publication #:
Pub Dt:
12/15/2005
Inventors:
James David Blackhall Smith, Gary Stevens, John William Wood
Title:
STRUCTURED RESIN SYSTEMS WITH HIGH THERMAL CONDUCTIVITY FILLERS
Assignment: 1
Reel/Frame:
016705/0056Recorded: 06/14/2005Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/13/2005
Exec Dt:
06/13/2005
Exec Dt:
06/10/2005
Exec Dt:
06/07/2005
Assignee:
4400 ALAFAYA TRAIL
ORLANDO, FLORIDA 32826
Correspondent:
ELSA KELLER
SIEMENS CORPORATION
INTELLECTUAL PROPERTY DEPARTMENT
170 WOOD AVENUE SOUTH
ISELIN, NJ 08830
Assignment: 2
Reel/Frame:
028323/0592Recorded: 06/05/2012Pages: 3
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/01/2005
Assignee:
4400 ALAFAYA TRAIL
ORLANDO, FLORIDA 32826
Correspondent:
SANDRA BAKER
SIEMENS CORPORATION - IP DEPARTMENT
170 WOOD AVENUE SOUTH
ISELIN, NJ 08830
Assignment: 3
Reel/Frame:
022488/0630Recorded: 03/31/2009Pages: 13
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
10/01/2008
Assignee:
4400 ALAFAYA TRAIL
ORLANDO, FLORIDA 32826
Correspondent:
ELSA KELLER
SIEMENS CORPORATION
INTELLECTUAL PROPERTY DEPARTMENT
170 WOOD AVENUE SOUTH
ISELIN, NEW JERSEY 08830

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