Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/17/2012
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Application #:
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11837261
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Filing Dt:
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08/10/2007
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Publication #:
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Pub Dt:
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02/14/2008
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Inventors:
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YOSHIHIRO OHKURA, YOSHIO FUKUDA
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Title:
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METHOD AND APPARATUS FOR INSPECTION OF WAFER AND SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10-1, NAKAZAWA-CHO |
| NAKA-KU, HAMAMATSU-SHI |
| SHIZUOKA-KEN, JAPAN |
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| MICHAEL J. SCHEER |
| DICKSTEIN SHAPIRO LLP |
| 1177 AVENUE OF THE AMERICAS |
| NEW YORK, NY 10036 |
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