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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
07/24/2012
Application #:
12262982
Filing Dt:
10/31/2008
Publication #:
Pub Dt:
05/28/2009
Inventors:
Romain Coffy, Jacky Seiller, Gil Provent
Title:
METHOD FOR FABRICATING ELECTRICAL BONDING PADS ON A WAFER
Assignment: 1
Reel/Frame:
021770/0824Recorded: 10/31/2008Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
07/07/2008
Exec Dt:
07/07/2008
Exec Dt:
07/28/2008
Assignee:
12, RUE JULES HOROWITZ
GRENOBLE, FRANCE F-38000
Correspondent:
GARDERE WYNNE SEWELL LLP
1601 ELM STREET
SUITE 3000
DALLAS, TX 75201-4761
Assignment: 2
Reel/Frame:
034083/0177Recorded: 10/29/2014Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/28/2014
Assignee:
12 RUE JULES HOROWITZ
GRENOBLE, FRANCE 38109
Correspondent:
GARDERE WYNNE SEWELL LLP
1601 ELM STREET, SUITE 3000
DALLAS, TX 75201
Assignment: 3
Reel/Frame:
034117/0523Recorded: 11/03/2014Pages: 15
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
05/28/2014
Assignee:
12 RUE JULES HOROWITZ
GRENOBLE, FRANCE 38109
Correspondent:
GARDERE WYNNE SEWELL LLP
1601 ELM STREET, SUITE 3000
DALLAS, TX 75201

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