Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/07/2012
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Application #:
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12838939
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Filing Dt:
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07/19/2010
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Publication #:
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Pub Dt:
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11/03/2011
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Inventor:
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Ming-Ching WU
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Title:
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METHOD FOR SEPARATING SEMICONDUCTOR WAFER INTO CHIPS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.31, WUGONG 5TH RD., |
| WUGU TOWNSHIP, TAIPEI COUNTY, TAIWAN 248 |
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| BROWDY AND NEIMARK, P.L.L.C. |
| 624 NINTH STREET, NW, SUITE 300 |
| WASHINGTON, DC 20001-5303 |
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