Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/21/2012
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Application #:
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12044191
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Filing Dt:
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03/07/2008
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Publication #:
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Pub Dt:
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09/10/2009
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Inventors:
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Kenji SUZUKI, Atsushi GOMI, Miho JOMEN
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Title:
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VOID-FREE COPPER FILLING OF RECESSED FEATURES USING A SMOOTH NON-AGGLOMERATED COPPER SEED LAYER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| AKASAKA BIZ TOWER, 3-1 AKASAKA 5-CHOME |
| MINATO-KU, TOKYO, JAPAN 107-6325 |
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| AUDUNN LUDVIKSSON |
| 4350 W CHANDLER BLVD |
| SUITE 10 |
| CHANDLER, AZ 85226 |
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