Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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08/28/2012
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Application #:
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12769725
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Filing Dt:
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04/29/2010
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Publication #:
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Pub Dt:
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03/17/2011
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Inventors:
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Wen-Chih CHIOU, Weng-Jin WU, Shau-Lin SHUE
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Title:
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PROTECTION LAYER FOR ADHESIVE MATERIAL AT WAFER EDGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300 |
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| LOWE HAUPTMAN HAM & BERNER, LLP (TSMC) |
| 1700 DIAGONAL ROAD, SUITE 300 |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 251 LITTLE FALLS DRIVE |
| WILMINGTON, DELAWARE 19808-1674 |
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| MARK SPOLYAR |
| ALMANAC IP ADVISORS LLP |
| 22 HOFFMAN AVE |
| SAN FRANCISCO, CA 94114 |
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