Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/28/2012
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Application #:
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12427870
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Filing Dt:
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04/22/2009
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Publication #:
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Pub Dt:
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08/19/2010
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Inventors:
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Hyung Soon Park, Noh Jung Kwak, Seung Jin Yeom, Sung Jun Kim, Choon Kun Ryu et al
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Title:
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METHOD FOR FORMING COPPER WIRING IN A SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SAN 136-1, AMI-RI, BUBAL-EUB, ICHEON-SI |
| KYOUNGKI-DO, KOREA, REPUBLIC OF |
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| RICHARD J. STREIT |
| LADAS & PARRY, 224 SOUTH MICHIGAN AVE. |
| CHICAGO, IL 60604 |
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