Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
09/04/2012
|
Application #:
|
12164404
|
Filing Dt:
|
06/30/2008
|
|
Publication #:
|
|
Pub Dt:
|
12/31/2009
| | | | |
|
Inventors:
|
Weng Khoon Mong, A. Vethanayagam Rudge, Mun Leong Loke, Kang Eu Ong, Bok Sim Lim et al
|
|
Title:
|
FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 2200 MISSION COLLEGE BOULEVARD |
| M/S SC4-202 |
| SANTA CLARA, CALIFORNIA 95052-5326 |
|
|
|
|
| INTEL CORPORATION C/O INTELLEVATE LLC |
| P.O. BOX 52050 |
| MINNEAPOLIS, MN 55402 |
|
|
Search Results as of:
05/22/2024 01:27 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
