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Patent Assignment Abstract of Title
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Total Assignments: 7
Patent #:
8258626
Issue Dt:
09/04/2012
Application #:
12586043
Filing Dt:
09/15/2009
Publication #:
20100065967
Pub Dt:
03/18/2010
Inventors:
Junichi Koike, Akihiro Shibatomi
Title:
COPPER INTERCONNECTION, METHOD FOR FORMING COPPER INTERCONNECTION STRUCTURE, AND SEMICONDUCTOR DEVICE
Assignment: 1
Reel/Frame:
023387/0794Recorded: 10/16/2009Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
SHIBATOMI, AKIHIRO
Exec Dt:
08/28/2009
Assignee:
ADVANCED INTERCONNECT MATERIALS LLC
6-6-40-402, AZA-AOBA, ARAMAKI, AOBA-KU
SENDAI-SHI, MIYAGI, JAPAN 980-0845
Correspondent:
MASUVALLEY & PARTNERS
SHIRIN BOZORGUI
8765 AERO DRIVE, SUITE 312
SAN DIEGO, CALIFORNIA 92123
Assignment: 2
Reel/Frame:
023398/0700Recorded: 10/16/2009Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
KOIKE, JUNICHI
Exec Dt:
09/03/2009
Assignee:
NATIONAL UNIVERSITY CORPORATION TOHOKU UNIVERSITY
1-1, KATAHIRA 2-CHOME
AOBA-KU
SENDAI-SHI, MIYAGI, JAPAN 980-8577
Correspondent:
MASUVALLEY & PARTNERS
SHIRIN BOZORGUI
8765 AERO DRIVE, SUITE 312
SAN DIEGO, CALIFORNIA 92123
Assignment: 3
Reel/Frame:
026008/0715Recorded: 03/21/2011Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
TOHOKU UNIVERSITY
Exec Dt:
02/07/2011
Assignee:
ADVANCED INTERCONNECT MATERIALS, LLC
6-6-40-402, AZA-AOBA, ARAMAKI AOBA-KU
SENDAI-SHI MIYAGI, JAPAN 980-0845
Correspondent:
PETER MARTINEZ MASUVALLEY & PARNTERS
8765 AERO DRIVE, SUITE 312
SAN DIEGO, CA 92123
Assignment: 4
Reel/Frame:
038078/0852Recorded: 03/23/2016Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
ADVANCED INTERCONNECT MATERIALS, LLC
Exec Dt:
03/19/2016
Assignee:
TOHOKU UNIVERSITY
2-1-1 KATAHIRA, AOBA-KU
SENDAI-SHI, MIYAGI, JAPAN 980-8577
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, DC 20037
Assignment: 5
Reel/Frame:
042859/0773Recorded: 06/29/2017Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
TOHOKU UNIVERSITY
Exec Dt:
06/09/2017
Assignee:
MATERIAL CONCEPT, INC.
6-6-40-408 AZA-AOBA, ARAMAKI, AOBA-KU
SENDAI-SHI, MIYAGI, JAPAN 9800845
Correspondent:
SUGHRUE MION, PLLC
2100 PENNSYLVANIA AVENUE, N.W.
SUITE 800
WASHINGTON, DC 20037
Assignment: 6
Reel/Frame:
058393/0355Recorded: 12/08/2021Pages: 45
Conveyance:
CHANGE OF ADDRESS
Assignor:
MATERIAL CONCEPT, INC.
Exec Dt:
09/03/2020
Assignee:
MATERIAL CONCEPT, INC.
468-1-201 AZA-AOBA, ARAMAKI, AOBA-KU
SENDAI-SHI, MIYAGI, JAPAN 9800845
Correspondent:
SUGHRUE MION PLLC
2000 PENNSYLVANIA AVENUE NW
SUITE 9000
WASHINGTON, DC 20006
Assignment: 7
Reel/Frame:
058347/0498Recorded: 12/09/2021Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
MATERIAL CONCEPT, INC.
Exec Dt:
11/25/2021
Assignee:
JX NIPPON MINING & METALS CORPORATION
2-10-4, TORANOMON, MINATO-KU
TOKYO, JAPAN
Correspondent:
SUGHRUE MION PLLC
2000 PENNSYLVANIA AVENUE NW
SUITE 9000
WASHINGTON, DC 20006

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