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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/11/2012
Application #:
12647856
Filing Dt:
12/28/2009
Publication #:
Pub Dt:
09/16/2010
Inventors:
Hsueh-An Yang, Pei-Chun Chen, Chien-Hua Chen
Title:
SILICON CHIP HAVING THROUGH VIA AND METHOD FOR MAKING THE SAME
Assignment: 1
Reel/Frame:
023711/0916Recorded: 12/29/2009Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/24/2009
Exec Dt:
12/24/2009
Exec Dt:
12/24/2009
Assignee:
26 CHIN 3RD ROAD
NANTZE EXPORT PROCESSING ZONE
KAOHSIUNG, TAIWAN
Correspondent:
MCCRACKEN & FRANK LLP
311 S. WACKER DRIVE
SUITE 2500
CHICAGO, IL 60606

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