Patent Assignment Abstract of Title
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Total Assignments:
4
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Patent #:
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Issue Dt:
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09/25/2012
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Application #:
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12884405
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Filing Dt:
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09/17/2010
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Publication #:
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Pub Dt:
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03/17/2011
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Inventors:
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Chew B. Chan, Mark Currie, Geraldine Kelly, Neil Poole, Qing Ji
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Title:
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METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE USING A FLUXING UNDERFILL COMPOSITION APPLIED TO SOLDER BALLS IN A DIP PROCESS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| TECHNOLOGIES HOUSE, WOOD LANE END, HEMEL HEMPSTEAD |
| HERTFORDSHIRE, UNITED KINGDOM HP2 4RQ |
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| HENKEL CORPORATION |
| ONE HENKEL WAY |
| ROCKY HILL, CT 06067 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE HENKEL WAY |
| ROCKY HILL, CONNECTICUT 06067 |
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| HENKEL CORPORATION |
| ONE HENKEL WAY |
| ROCKY HILL, CT 06067 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ONE HENKEL WAY |
| ROCKY HILL, CONNECTICUT 06067 |
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| HENKEL CORPORATION |
| ONE HENKEL WAY |
| ROCKY HILL, CT 06067 |
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Assignment:
4
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HENKELSTRASSE 67 |
| DUESSELDORF, GERMANY 40589 |
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| HENKEL CORPORATION |
| ONE HENKEL WAY |
| ROCKY HILL, CT 06067 |
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