Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/02/2012
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Application #:
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12469669
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Filing Dt:
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05/20/2009
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Publication #:
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Pub Dt:
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10/14/2010
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Inventors:
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Chia-En Lee, Cheng-Ta Kuo, Der-Ling Hsia
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Title:
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LIGHT-EMITTING DIODE PACKAGE AND WAFER-LEVEL PACKAGING PROCESS OF LIGHT-EMITTING DIODE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8F., NO. 23, LI-HSIN RD., SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU CITY, TAIWAN |
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| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7F.-1, NO.100, ROOSEVELT RD., SEC. 2 |
| TAIPEI, 100 TAIWAN |
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