Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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10/16/2012
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Application #:
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12779818
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Filing Dt:
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05/13/2010
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Publication #:
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Pub Dt:
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12/23/2010
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Inventors:
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SHIH-FU HUANG, Yuan-Chang Su, Chia-Cheng Chen, Kuang-Hsiung Chen, Ming-Chiang Lee et al
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Title:
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SEMICONDUCTOR PACKAGE WITH SUBSTRATE HAVING SINGLE METAL LAYER AND MANUFACTURING METHODS THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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26 CHIN 3RD ROAD |
NANTZE EXPORT PROCESSING ZONE |
KAOSIUNG, TAIWAN |
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COOLEY LLP |
777 SIXTH STREET N.W. |
SUITE 1100 |
WASHINGTON, DC 20001 |
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