Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/23/2012
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Application #:
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11459503
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Filing Dt:
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07/24/2006
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Publication #:
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Pub Dt:
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01/24/2008
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Inventors:
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Kwok Kee Chung, Kui Kam Lam, Wai Yuen Cheung, Chi Keung Leung
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Title:
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AUTOMATIC LEVEL ADJUSTMENT FOR DIE BONDER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 20/F., WATSON CENTRE, 16-22 KUNG YIP ST., |
| KWAI CHUNG |
| HONG KONG, CHINA |
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| OSTROLENK, FABER, GERB & SOFFEN LLP |
| 1180 AVE OF THE AMERICAS |
| NEW YORK, NY 10036 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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Assignment:
3
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NUNC PRO TUNC ASSIGNMENT (SEE DOCUMENT FOR DETAILS).
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| 2 YISHUN AVENUE 7 |
| SINGAPORE, SINGAPORE 768924 |
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| CPA GLOBAL LIMITED |
| LIBERATION HOUSE |
| CASTLE STREET |
| ST HELIER, JE1 1BL JERSEY |
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