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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8293634
Issue Dt:
10/23/2012
Application #:
12187646
Filing Dt:
08/07/2008
Publication #:
20100032829
Pub Dt:
02/11/2010
Inventors:
Felix P. Anderson, William Cote, Anthony K. Stamper, Daniel C. Edelstein et al
Title:
STRUCTURES AND METHODS FOR IMPROVING SOLDER BUMP CONNECTIONS IN SEMICONDUCTOR DEVICES
Assignment: 1
Reel/Frame:
021359/0616Recorded: 08/08/2008Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
ANDERSON, FELIX P.
Exec Dt:
08/05/2008
COTE, WILLIAM
Exec Dt:
08/06/2008
EDELSTEIN, DANIEL C.
Exec Dt:
08/06/2008
MCDEVITT, THOMAS L.
Exec Dt:
08/05/2008
STAMPER, ANTHONY K.
Exec Dt:
08/04/2008
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
GREENBLUM & BERNSTEIN, P.L.C.
1950 ROLAND CLARKE PLACE
RESTON, VA 20191
Assignment: 2
Reel/Frame:
031111/0438Recorded: 08/29/2013Pages: 8
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
INTERNATIONAL BUSINESS MACHINES
Exec Dt:
08/05/2013
Assignee:
ULTRATECH, INC.
3050 ZANKER ROAD
SAN JOSE, CALIFORNIA 95134
Correspondent:
ALLSTON L. JONES
425 SHERMAN AVENUE, SUITE 230
PALO ALTO, CA 94306

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