Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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10/30/2012
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Application #:
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12494574
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Filing Dt:
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06/30/2009
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Publication #:
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Pub Dt:
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09/23/2010
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Inventors:
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DONG-SHENG LIN, TZYY-CHYI TSAI, JIA-JIE CHEN
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Title:
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BONDING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 2, 2ND DONGHUAN ROAD,LONGHUA TOWN, BAO' AN DISTRICT |
| SHENZHEN CITY, GUANGDONG PROVINCE, CHINA |
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| 66,CHUNG SHAN ROAD |
| TU-CHENG,TAIPEI HSIEN, TAIWAN |
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| CLIFFORD O. CHI |
| 458 E. LAMBERT ROAD |
| FULLERTON, CA 92835 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.1216 LANHUA ROAD,JINCHENG ECONOMIC AND TECHNOLOGY DEVELOPMENT ZONE |
| JINCHENG, CHINA |
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| ZHIGANG MA |
| 550 S. HOPE STREET, SUITE 2825 |
| LOS ANGELES, CA 90071 |
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