Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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10/30/2012
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Application #:
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12261156
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Filing Dt:
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10/30/2008
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Publication #:
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Pub Dt:
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03/04/2010
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Inventor:
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Min Suk Suh
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Title:
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SUBSTRATE FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE HAVING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| SAN 136-1, AMI-RI, BUBAL-EUB, ICHEON-SI |
| KYOUNGKI-DO, KOREA, REPUBLIC OF |
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| RICHARD J. STREIT |
| LADAS & PARRY, 224 SOUTH MICHIGAN AVE. |
| CHICAGO, IL 60604 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 2091 GYEONGCHUNGDAE-RO, BUBAL-EUP, ICHEON-SI |
| GYEONGGI-DO, KOREA, REPUBLIC OF |
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| RICHARD J. STREIT |
| LADAS & PARRY, 224 SOUTH MICHIGAN AVE. |
| CHICAGO, IL 60604 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9330 LBJ FREEWAY |
| SUITE 900 |
| DALLAS, TEXAS 75243 |
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| ROBERT D. LEONARD |
| VOLPE KOENIG |
| 30 SOUTH 17TH STREET, 18TH FLOOR |
| PHILADELPHIA, PA 19103 |
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