Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/06/2012
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Application #:
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11662475
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Filing Dt:
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07/12/2007
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Publication #:
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Pub Dt:
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05/08/2008
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Inventors:
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Tetsuhiro Matsunaga, Toshifumi Matsushima, Tetsuro Sato, Kensuke Nakamura, Hiroyuki Kon et al
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Title:
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ELECTRODEPOSITED COPPER FOIL WITH CARRIER FOIL WITH A PRIMER RESIN LAYER AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, OSAKI 1-CHOME, SHINAGAWA-KU |
| TOKYO 1418584, JAPAN |
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| ROTHWELL FIGG ERNST, ET AL. |
| SUITE 800 |
| 1425 K ST., N.W. |
| WASHINGTON, DC 20005 |
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