Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/13/2012
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Application #:
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12067355
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Filing Dt:
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06/08/2010
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Publication #:
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Pub Dt:
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10/21/2010
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Inventors:
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Masayuki Nakano, Yoshikazu Oshika
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Title:
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SOLDER LAYER, HEAT SINK USING SUCH A SOLDER LAYER AND METHOD FOR MANUFACTURING SUCH A HEAT SINK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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14-1, SOTOKANDA 4-CHOME, CHIYODA-KU |
TOKYO, JAPAN 101-0021 |
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MASAO YOSHIMURA, CHEN YOSHIMUA LLP |
1101 PENNSYLVANIA AVE., NW |
6TH FLOOR |
WASHINGTON, DC 20004 |
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