Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/13/2012
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Application #:
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13280368
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Filing Dt:
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10/25/2011
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Publication #:
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Pub Dt:
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02/09/2012
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Inventors:
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Nan-Cheng Chen, Chih-Tai Hsu
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Title:
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PACKAGE-ON-PACKAGE WITH FAN-OUT WLCSP
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN |
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| WINSTON HSU |
| P.O.BOX 506 |
| MERRIFIELD, VA 22116 |
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