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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
8314006
Issue Dt:
11/20/2012
Application #:
12934788
Filing Dt:
01/20/2011
Publication #:
20110104871
Pub Dt:
05/05/2011
Inventors:
Yuji Tobisaka, Yoshihiro Kubota, Atsuo Ito, Kouichi Tanaka, Makoto Kawai, Shoji Akiyama et al
Title:
METHOD FOR MANUFACTURING BONDED WAFER
Assignment: 1
Reel/Frame:
025671/0135Recorded: 01/20/2011Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TOBISAKA, YUJI
Exec Dt:
12/27/2010
KUBOTA, YOSHIHIRO
Exec Dt:
12/27/2010
ITO, ATSUO
Exec Dt:
12/27/2010
TANAKA, KOUICHI
Exec Dt:
12/27/2010
KAWAI, MAKOTO
Exec Dt:
12/27/2010
AKIYAMA, SHOJI
Exec Dt:
12/27/2010
TAMURA, HIROSHI
Exec Dt:
12/27/2010
Assignee:
SHIN-ETSU CHEMICAL CO., LTD.
6-1, OTEMACHI 2-CHOME
CHIYODA-KU, TOKYO 1000004, JAPAN
Correspondent:
JOSEPH H. KARLIN
LERNER, DAVID, LITTENBERG, KRUMHOLZ & MENTLIK, LLP
600 SOUTH AVENUE WEST
WESTFIELD, NJ 07090
Assignment: 2
Reel/Frame:
060655/0351Recorded: 07/28/2022Pages: 20
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
THERATECHNOLOGIES INC.
Exec Dt:
07/27/2022
Assignee:
U.S. BANK TRUST COMPANY, NATIONAL ASSOCIATION
ONE FEDERAL STREET
BOSTON, MASSACHUSETTS 02110
Correspondent:
CADWALADER, WICKERSHAM & TAFT LLP
200 LIBERTY STREET
NEW YORK, NY 10281

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