Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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11/27/2012
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Application #:
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13181856
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Filing Dt:
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07/13/2011
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Publication #:
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Pub Dt:
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01/19/2012
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Inventors:
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Tomohiro MURAKAMI, Takahiko KATO, Masato NAKAMURA, Takeshi TERASAKI
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Title:
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A SEMICONDUCTOR PACKAGE HAVING EXTERIOR PLATING FILMS FORMED OVER SURFACES OF OUTER LEADS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1753, SHIMONUMABE, NAKAHARA-KU, KAWASAKI-SHI, |
| KANAGAWA, JAPAN |
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| MCDERMOTT WILL & EMERY LLP |
| 600 13TH STREET, N.W. |
| WASHINGTON, DC 20005-3096 |
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Assignment:
2
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| 2-24, TOYOSU 3-CHOME, KOUTOU-KU |
| TOKYO, JAPAN |
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| MATTINGLY & MALUR, PC |
| 1800 DIAGONAL ROAD |
| SUITE 210 |
| ALEXANDRIA, VA 22314 |
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