Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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12/04/2012
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Application #:
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11728184
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Filing Dt:
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03/22/2007
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Publication #:
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Pub Dt:
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06/05/2008
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Inventors:
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Wen Shi, Wei Wei Ruan
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Title:
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RELIABILITY TEST STRUCTURE FOR MULTILEVEL INTERCONNECT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 18 ZHANG JIANG RD |
| PUDONG NEW AREA |
| SHANGHAI, CHINA 201203 |
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| KENT J. TOBIN |
| TOWNSEND AND TOWNSEND AND CREW LLP |
| TWO EMBACADERO CENTER |
| EIGHTH FLOOR |
| SAN FRANCISCO, CA 94111-3834 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 18 ZHANG JIANG RD. |
| PUDONG NEW AREA |
| SHANGHAI, CHINA 201203 |
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| 18 WEN CHANG ROAD, ECONOMIC-TECHNOLOGICAL DEVELOPMENT AREA |
| DAXING DISTRICT |
| BEIJING, CHINA 100176 |
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| KILPATRICK TOWNSEND AND STOCKTOWN, LLP |
| TWO EMBARCADERO CENTER |
| EIGHTH FLOOR |
| SAN FRANCISCO, CA 94111-3834 |
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