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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
8329575
Issue Dt:
12/11/2012
Application #:
12977060
Filing Dt:
12/22/2010
Publication #:
20120164829
Pub Dt:
06/28/2012
Inventors:
Nagarajan Rajagopalan, Ji Ae Park, Ryan Yamase, Shamik Patel, Thomas Nowak, Li-Qun Xia et al
Title:
FABRICATION OF THROUGH-SILICON VIAS ON SILICON WAFERS
Assignment: 1
Reel/Frame:
026102/0398Recorded: 04/11/2011Pages: 26
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
RAJAGOPALON, NAGARAJAN
Exec Dt:
02/15/2011
PARK, JI AE
Exec Dt:
02/15/2011
YAMASE, RYAN
Exec Dt:
03/04/2011
PATEL, SHAMIK
Exec Dt:
02/23/2011
NOWAK, THOMAS
Exec Dt:
02/15/2011
XIA, LI-QUN
Exec Dt:
03/02/2011
KIM, BOK HOEN
Exec Dt:
02/22/2011
DING, RAN
Exec Dt:
02/22/2011
BALDINO, JIM
Exec Dt:
04/05/2011
NAIK, MEHUL
Exec Dt:
03/04/2011
RAMASWANI, SESH
Exec Dt:
02/24/2011
Assignee:
APPLIED MATERIALS, INC.
P. O. BOX 450A
SANTA CLARA, CALIFORNIA 95052
Correspondent:
APPLIED MATERIALS
P.O. BOX 450A
SANTA CLARA, CA 95052

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