Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
2
|
|
Patent #:
|
|
Issue Dt:
|
01/01/2013
|
Application #:
|
12801218
|
Filing Dt:
|
05/27/2010
|
|
Publication #:
|
|
Pub Dt:
|
12/02/2010
| | | | |
|
Inventors:
|
Takeshi Kamikawa, Masataka Ohta
|
|
Title:
|
NITRIDE SEMICONDUCTOR WAFER, NITRIDE SEMICONDUCTOR CHIP, AND METHOD OF MANUFACTURE OF NITRIDE SEMICONDUCTOR CHIP
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 22-22, NAGAIKE-CHO |
| ABENO-KU, OSAKA-SHI |
| OSAKA, JAPAN 545-8522 |
|
|
|
|
| DONALD J. DALEY |
| HARNESS, DICKEY & PIERCE, P.L.C. |
| P.O. BOX 8910 |
| RESTON, VA 20195 |
|
|
|
Assignment:
2
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 1, ASAHI, DAIMON-CHO |
| FUKUYAMA CITY, HIROSHIMA, JAPAN 721-8522 |
|
|
|
|
| CALVIN H CHAI |
| 550 S. HOPE STREET, STE 2825 |
| LOS ANGELES, CA 90071 |
|
|
Search Results as of:
04/27/2024 06:13 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
