Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/05/2013
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Application #:
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12756982
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Filing Dt:
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04/08/2010
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Publication #:
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Pub Dt:
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10/13/2011
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Inventors:
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Chien-Hsin Huang, Li-Che Chen, Ming-I Wang, Bang-Chiang Lan, Hui-Min Wu, Tzung-I Su
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Title:
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WAFER LEVEL PACKAGE OF MEMS MICROPHONE AND MANUFACTURING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 3, LI-HSIN RD. II, SCIENCE-BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN |
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| CHUN-MING SHIH |
| 13611 NORTHBOURNE DR. |
| CENTREVILLE, VA 20120 |
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