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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
02/12/2013
Application #:
12873945
Filing Dt:
09/01/2010
Publication #:
Pub Dt:
03/01/2012
Inventors:
John A. Harada, Robert J. Drost, David C. Douglas
Title:
MANUFACTURING FIXTURE FOR A RAMP-STACK CHIP PACKAGE USING SOLDER FOR COUPLING A RAMP COMPONENT
Assignment: 1
Reel/Frame:
025102/0177Recorded: 10/06/2010Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
08/04/2010
Exec Dt:
08/24/2010
Exec Dt:
08/04/2010
Assignee:
500 ORACLE PARKWAY
MAIL STOP 5OP7
REDWOOD CITY, CALIFORNIA 94065
Correspondent:
EDWARD J. GRUNDLER
PARK, VAUGHAN & FLEMING, LLP
2820 FIFTH STREET
DAVIS, CA 95618

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