Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/05/2013
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Application #:
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11919368
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Filing Dt:
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09/10/2009
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Publication #:
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Pub Dt:
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12/24/2009
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Inventors:
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Masahiko Kimbara, Keiji Toh, Hidehito Kubo, Katsufumi Tanaka, Kota Otoshi, Eiji Kono et al
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Title:
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HEAT SINK FOR POWER MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2-1, TOYODA-CHO, KARIYA-SHI |
AICHI-KEN, JAPAN 448-8671 |
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13-9, SHIBA DAIMON 1-CHOME, MINATO-KU |
TOKYO, JAPAN 105-8518 |
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LOCKE LORD BISSELL & LIDDELL LLP ATTN: I |
THREE WORLD FINANCIAL CENTER |
NEW YORK, NY 10281-2101 |
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