Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/05/2013
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Application #:
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12720704
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Filing Dt:
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03/10/2010
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Publication #:
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Pub Dt:
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09/16/2010
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Inventors:
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Takashi HABU, Fumiteru ASAI, Tomokazu TAKAHASHI, Akinori NISHIO, Toshio SHINTANI
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Title:
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SUBSTRATE-LESS PRESSURE-SENSITIVE ADHESIVE SHEET FOR PROTECTION OF SEMICONDUCTOR WAFER, METHOD FOR GRINDING BACK SIDE OF SEMICONDUCTOR WAFER USING PRESSURE-SENSITIVE ADHESIVE SHEET, AND METHOD FOR PRODUCING PRESSURE-SENSITIVE ADHESIVE SHEET
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2, SHIMOHOZUMI 1-CHOME |
| IBARAKI-SHI, OSAKA, JAPAN |
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| SUGHRUE-265550 |
| 2100 PENNSYLVANIA AVE. NW |
| WASHINGTON, DC 20037-3213 |
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