Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/05/2013
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Application #:
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11476382
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Filing Dt:
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06/28/2006
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Publication #:
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Pub Dt:
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07/12/2007
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Inventors:
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Takeshi Segawa, Koichi Yamaguchi, Yuichi Iwakata
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Title:
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SEMICONDUCTOR WAFER PROCESSING TAPE WINDING BODY, SEMICONDUCTOR WAFER PROCESSING TAPE STICKING APPARATUS AND SEMICONDUCTOR WAFER PROCESSING APPARATUS THAT USE THE SEMICONDUCTOR WAFER PROCESSING TAPE WINDING BODY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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23-23, HONCHO, ITABASHI-KU |
TOKYO, JAPAN |
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KENT E. BALDAUF |
THE WEBB LAW FIRM |
700 KOPPERS BUILDING |
436 SEVENTH AVENUE |
PITTSBURGH, PA 15219 |
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