Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/19/2013
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Application #:
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12844590
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Filing Dt:
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07/27/2010
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Publication #:
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Pub Dt:
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02/02/2012
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Inventors:
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Kuo-Ching CHANG, Wu-Cheng Kuo, Tzu-Han Lin
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Title:
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CHIP PACKAGE AND FABRICATING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 12, DUSING RD. 1, |
| HSINCHU SCIENCE PARK, TAIWAN 300-78 |
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| MUNCY, GEISSLER, OLDS & LOWE, PLLC |
| 4000 LEGATO ROAD |
| SUITE 310 |
| FAIRFAX, VA 22033 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 12, DUSING RD. 1, |
| HSINCHU SCIENCE PARK |
| HSIN-CHU CITY, TAIWAN 30078 |
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| 3F, NO. 11, KE JUNG RD., CHU-NAN SITE |
| HSINCHU SCIENCE PARK |
| CHU-NAN, MIAO-LI COUNTY, TAIWAN 350 |
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| JOE MCKINNEY MUNCY |
| 4000 LEGATO RD., STE 310 |
| FAIRFAX, VA 22030 |
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