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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/26/2013
Application #:
11170369
Filing Dt:
06/29/2005
Publication #:
Pub Dt:
01/04/2007
Inventor:
Jhon Jhy Liaw
Title:
INTERCONNECT STRUCTURE FOR INTEGRATED CIRCUITS
Assignment: 1
Reel/Frame:
017475/0908Recorded: 06/29/2005Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/16/2005
Assignee:
NO. 8, LI-HSIN ROAD 6
SCIENCE BASED INDUSTRIAL PARK
HSHIN-CHU, TAIWAN 300-77
Correspondent:
HOWARD CHEN
PRESTON GATES & ELLIS LLP
55 SECOND STREET
SUITE 1700
SAN FRANCISCO, CA 94105

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