Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/23/2013
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Application #:
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13202764
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Filing Dt:
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08/22/2011
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Publication #:
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Pub Dt:
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02/16/2012
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Inventors:
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Masayoshi Uehira, Akihiro Iwane, Akihiko Matsumoto, Takahito Muroi
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Title:
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Die Assembly for Injection Molding
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2970 ISHIKAWA-MACHI, HACHIOJI-SHI, |
| TOKYO, JAPAN 192-8505 |
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| COZEN O'CONNOR |
| 277 PARK AVENUE |
| NEW YORK,, NY 10172 |
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