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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/23/2013
Application #:
13698684
Filing Dt:
11/19/2012
Publication #:
Pub Dt:
04/11/2013
Inventors:
Masanori Ikeda, Michinori Tomomatsu, Masahiro Taniguchi, Yousuke Hassaku et al
Title:
METHOD OF DETERMINING SOLDER PASTE HEIGHT AND DEVICE FOR DETERMINING SOLDER PASTE HEIGHT
Assignment: 1
Reel/Frame:
029911/0291Recorded: 03/04/2013Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/29/2012
Exec Dt:
10/29/2012
Exec Dt:
10/29/2012
Exec Dt:
10/29/2012
Exec Dt:
10/29/2012
Assignee:
1006 OAZA KADOMA, KADOMA-SHI
OSAKA, JAPAN 571-8501
Correspondent:
PANASONIC PATENT CENTER
1130 CONNECTICUT AVE., N.W., SUITE 1100
WASHINGTON, DC 20036

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