Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/30/2013
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Application #:
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13234842
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Filing Dt:
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09/16/2011
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Publication #:
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Pub Dt:
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03/21/2013
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Inventor:
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Geng-Shin Shen
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Title:
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SOLDER CAP BUMP IN SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 1, R&D 1ST RD., SCIENCE-BASED INDUSTRIAL PARK, |
HSINCHU, TAIWAN |
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CHE-YANG CHEN |
7309 TERESA AVE. |
ROSEMEAD, CA 91770 |
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